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ADT7318 View Datasheet(PDF) - Analog Devices

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Description
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ADT7318 Datasheet PDF : 44 Pages
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ADT7316/ADT7317/ADT7318
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
VDD to GND
Digital Input Voltage to GND
Digital Output Voltage to GND
Reference Input Voltage to GND
Operating Temperature Range
Storage Temperature Range
Junction Temperature
16-Lead QSOP
Power Dissipation1
Thermal Impedance2
θJA Junction-to-Ambient
θJC Junction-to-Case
IR Reflow Soldering
Peak Temperature
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
IR Reflow Soldering (Pb-Free Package)
Peak Temperature
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
Time 25°C to Peak Temperature
Rating
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−40°C to +120°C
−65°C to +150°C
150°C
(TJ max − TA)/θJA
105.44°C/W
38.8°C/W
220°C (0/5°C)
10 sec to 20 sec
2°C/sec to 3°C/sec
−6°C/sec
260°C (+ 0°C)
20 sec to 40 sec
3°C/sec maximum
–6°C/sec maximum
8 minutes maximum
1 Values relate to package being used on a 4-layer board.
2 Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient resistance is more useful for air-cooled, PCB-
mounted components.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 4. I2C Address Selection
ADD Pin
I2C Address
Low
1001 000
Float
1001 010
High
1001 011
ESD CAUTION
Rev. B | Page 10 of 44

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