ADXL377 View Datasheet(PDF) - Analog Devices

Part Name

Description

Manufacturer

ADXL377

Small, Low Power, 3-Axis ±200 g Accelerometer

Analog Devices 

Data Sheet

ADXL377

LAYOUT AND DESIGN RECOMMENDATIONS

Figure 16 shows the recommended soldering profile; Table 6 describes the profile features. Figure 17 shows the recommended PCB layout

or solder land drawing.

TP

TL

TSMAX

TSMIN

tP

RAMP-UP

CRITICAL ZONE

TL TO TP

tL

tS

PREHEAT

RAMP-DOWN

t25°C

TIME

Figure 16. Recommended Soldering Profile

Table 6. Recommended Soldering Profile

Profile Feature

Average Ramp Rate (TL to TP)

Preheat

Minimum Temperature (TSMIN)

Maximum Temperature (TSMAX)

Time, TSMIN to TSMAX (tS)

Ramp-Up Rate (TSMAX to TL)

Time Maintained Above Liquidous (tL)

Liquidous Temperature (TL)

Peak Temperature (TP)

Time Within 5°C of Actual Peak Temperature (tP)

Ramp-Down Rate (TP to TL)

Time 25°C to Peak Temperature (t25°C)

Sn63/Pb37

3°C/sec max

100°C

150°C

60 sec to 120 sec

3°C/sec max

60 sec to 150 sec

183°C

240°C + 0°C/−5°C

10 sec to 30 sec

6°C/sec max

6 minutes max

Pb-Free

3°C/sec max

150°C

200°C

60 sec to 180 sec

3°C/sec max

60 sec to 150 sec

217°C

260°C + 0°C/−5°C

20 sec to 40 sec

6°C/sec max

8 minutes max

0.30

MAX

0.40

MAX

3

0.25

0.50

0.50

1.60

CENTER PAD IS NOT

INTERNALLY CONNECTED

BUT SHOULD BE SOLDERED

FOR MECHANICAL INTEGRITY

3

0.25

1.60

DIMENSIONS SHOWN IN MILLIMETERS

Figure 17. Recommended PCB Layout

Rev. 0 | Page 11 of 12

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