AM29LV200BB-70RDFC View Datasheet(PDF) - Advanced Micro Devices

Part Name

Description

Manufacturer

AM29LV200BB-70RDFC

2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1

Advanced Micro Devices 

SUPPLEMENT

PHYSICAL SPECIFICATIONS

Active Die dimensions . x = 3462.6 µm; y = 3277.8 µm

. . . . . . . . . . . . . . . . . . . x = 136.3 mils; y = 129.0 mils

Scribe width . . . . . . . . . . . . x = 87.4 µm; y = 232.2 µm

. . . . . . . . . . . . . . . . . . . . . x = 3.44 mils; y = 9.03 mils

Step dimensions . . . . . . . . x = 3.56 mm; y = 3.51 mm

. . . . . . . . . . . . . . . . . x = 139.76 mils; y = 138.19 mils

Die Thickness. . . . . . . . . . . . .500 µm = 483 +/–51 µm

. . . . . . . . . . . . . . . . . . . . . . . 280 µm = 280 +/–15 µm

Bond Pad Size . . . . . . . . . . . . . . 115.9 µm x 115.9 µm

. . . . . . . . . . . . . . . . . . . . . . . . . . 4.69 mils x 4.69 mils

Minimum pad pitch . . . . . . . . . . . . . . . . . . . . 137.8 µm

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.43 mils

Pad Area Free of Passivation . . . . . . . . . . 13.99 mils2

Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43

Bond Pad Metalization . . . . . . . . . . . . . . . . . . . . Al/Cu

. . . . . . . . . . . . . . . . . . . . Minimum thickness: 10500 Å

Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,

may be grounded with Back-grind type finish (optional)

Passivation . . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride

. . . . . . . . . . . . . . . . . . . . Minimum thickness: 14700 Å

Ink dot height . . . . . . . . . . . . . . . . . . . . . .0.8 mils max

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20.3 µm max

Ink dot diameter . . . . . . . . . . . . . . . . . . . . .15 mils min

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 381 µm min

DC OPERATING CONDITIONS

VCC (Supply Voltage) . . . . . . . . . . . . . . 2.7 V to 3.6 V

Operating Temperature

Industrial . . . . . . . . . . . . . . . . . . .–40°C to +85°C

Commercial . . . . . . . . . . . . . . . . . . .0°C to +70°C

Extended . . . . . . . . . . . . . . . . . .–55°C to +125°C

MANUFACTURING INFORMATION

Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . FASL

Test . . . . . . . . . . . . . . . . . . . . . . . . Penang, Malaysia

Manufacturing ID (Top Boot) . . . . . . . . . . . . . 98488AK

(Bottom Boot) . . . . . . . . . . . . . . . . . . . . . . .98488ABK

Preparation for Shipment . . . . . . . . Penang, Malaysia

Fabrication Process . . . . . . . . . . . . . . . . . . . . CS39S

Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

SPECIAL HANDLING INSTRUCTIONS

Processing

Do not expose KGD products to ultraviolet light or

process them at temperatures greater than 250°C.

Failure to adhere to these handling instructions will

result in irreparable damage to the devices. For best

yield, AMD recommends assembly in a Class 10K

clean room with 30% to 60% relative humidity.

Storage

Store at a maximum temperature of 30°C in a nitrogen-

purged cabinet or vacuum-sealed bag. Observe all

November 18, 2003

Am29LV200B Known Good Die

9

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