AN80T05 View Datasheet(PDF) - Panasonic Corporation
Part Name
Description
Manufacturer
AN80T05
Panasonic Corporation
AN80T05 Datasheet PDF : 12 Pages
| |||
Prepared Lim Fuey Sheen
Checked Kenneth Law
Approved Yasuo Higuchi
Product Specifications
(Leadfree)
AN80T05
Ref No.
F
Total Page
11
Page No.
9A
(Structure Description)
Chip surface passivation SiN,
PSG,
Others (
)1
Lead frame material
Fe group,
Cu group,
Others (
) 2, 6
Inner lead surface process Ag plating, Au plating,
Others (
*3 Outer lead surface process Solder plating (98Sn-2Bi), Solder dip, Others (
)2
)6
*3 Chip mounting method Ag paste, Au-Si alloy, Solder (95.5Pb-2.5Ag-2Sn)** 3
Wire bonding method
Thermalsonic bonding,
Others (
)4
Wire material
Au,
Others (
)4
Mold material
Epoxy,
Others (
)5
Molding method
Transfer mold, Multiplunger mold, Others (
)5
Fin material
Cu group,
Others (
)7
Package FP-12S
**Under RoHS exemption clause, Lead (Pb) in high melting
temperature type solder (i.e. tin-lead solder alloys containing more
than 85% of lead), is exempted until 2010.
1
43
5
6
7
2
Eff. Date Eff. Date
-
-
FMSC-PSDA-002-01 REV 1
*3
Eff. Date Eff. Date
- 16-DEC-04
Semiconductor Company, Matsushita Electric Industrial Co., Ltd.
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