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AP3152(2009) View Datasheet(PDF) - Diodes Incorporated.

Part Name
Description
Manufacturer
AP3152
(Rev.:2009)
Diodes
Diodes Incorporated. Diodes
AP3152 Datasheet PDF : 13 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
AP3152
120mA HIGH EFFICIENCY WHITE LED DRIVER
Electrical Characteristics
CIN = COUT = C1 = C2 = 1.0µF; TA = 25°C, VIN = 3.5V. Unless otherwise stated.
Symbol
Description
Conditions
Min
Typ.
IQ
ISHDN
IDX
ID-Match
TSS
FCLK
FSSP
VSDI(L)
VSDI(H)
TSLO
TSHI
fPWM
TPWM
TPLO
TPHI
TOFF
TSEP
Quiescent Current
Shutdown Current
ISINK Current Accuracy
(Note 4)
Current Matching
(Note 5)
Soft-start Time
Switching Clock Frequency
Spread Spectrum
SDI Threshold Low
SDI Threshold High
SDI Low Time
SDI High Time
PWM Frequency (Range 1)
PWM Frequency (Range 2)
PWM Signal Period
PWM Signal Low (LED off)
PWM Signal High (LED on)
Chip Disable (held low)
Interval between SDI
sequences (held high)
1X Mode
Fosc=1.2MHz,
SDI=HIGH, no load
SDI = 0
-1
ISINK = 20mA
-10
VF: D1=D2=D3=D4
ID = 2, 20mA
Enabled
VIN = 2.7V to 5.5V
VIN = 2.7V to 5.5V
PWM
No PWM
PWM
No PWM
1.6
0.05
0.05
0.2
20
1/
fPWM-Max
1
1
1.2
1
0.6/1.2/1.8
+10
65
512
65
512
ISDI SDI Input Leakage
ISCP
VOUT Short to GND hold
Current
TSD
Thermal Shutdown
Temperature
θJA
Thermal Resistance1 –
Junction to Ambient
Maximum Thermal
θJC Resistance1 –
Junction to Case
DFN3030-12
(Note 6)
DFN3030-12
(Note 6)
-1
500
+150
160
21
Notes:
4. Determined by the average current levels of all active channels.
5. Defined as the deviation of any sink current from the average of all active current channels.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
Max Units
mA
1
µA
10
%
5
%
ms
MHz
%
0.4
V
V
50
µs
50
µs
1.5
KHz
30
KHz
1/ fPWM-Min µs
TPWM – 1 µs
TPWM – 1 µs
100
ms
800
µs
100
ms
800
µs
1
µA
mA
°C
°C/W
°C/W
AP3152 Rev. 3
5 of 13
www.diodes.com
FEBRUARY 2009
© Diodes Incorporated

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