APA0714 View Datasheet(PDF) - Anpec Electronics

Part Name

Description

Manufacturer

APA0714

3W Mono Fully Differential Audio Power Amplifier

Anpec Electronics 

APA0714

Ordering and Marking Information

APA0714

Assembly Material

Handling Code

Temperature Range

Package Code

Package Code

X : MSOP-8 XA : MSOP-8P QB : TDFN3x3-8

Operating Ambient Temperature Range

I : -40 to 85 oC

Handling Code

TR : Tape & Reel

Assembly Material

G : Halogen and Lead Free Device

APA0714 X :

A0714

XXX

XX

XXXXX - Date Code

APA0714 XA :

A0714

XXX

XX

XXXXX - Date Code

APA0714 QB :

APA

0714

XXXXX

XXXXX - Date Code

Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

Absolute Maximum Ratings (Note 1)

Symbol

Parameter

Rating

Unit

VDD

Supply Voltage

-0.3 to 6

V

Input Voltage (INN, INP, SD to GND)

VIN

Input Voltage (OUTN, OUTP to GND)

TJ

Maximum Junction Temperature

TSTG

Storage Temperature Range

TSDR

Maximum Soldering Temperature Range, 10 Seconds

-0.3 to 6

V

-0.3 to VDD +0.3

150

οC

-65 to +150

οC

260

οC

PD

Power Dissipation

Internally Limited

W

Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Thermal Characteristics

Symbol

θJA

Parameter

Thermal Resistance -Junction to Ambient (Note 2)

MSOP-8

MSOP-8P

TDFN3x3-8

Typical Value

200

50

52

Unit

οC/W

Thermal Resistance -Junction to Case (Note 3)

θJC

MSOP-8P

10

TDFN3x3-8

11

οC/W

Note 2: Please refer to “ Layout Recommendation”, the Thermal Pad on the bottom of the IC should soldered directly to the PCB’s

ThermalPad area that with several thermal vias connect to the ground plan, and the PCB is a 2-layer, 5-inch square area with 2oz

copper thickness.

Note 3: The case temperature is measured at the center of the Thermal Pad on the underside of the MSOP-8P and TDFN3x3-8

package.

Copyright © ANPEC Electronics Corp.

2

Rev. A.2 - Apr., 2010

www.anpec.com.tw

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