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APL1187 View Datasheet(PDF) - Anpec Electronics

Part Name
Description
Manufacturer
APL1187 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
APL1187
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material: 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition (IR/Convection or VPR Reflow)
TP
tp
Ramp-up
Critical Zone
TL to TP
TL
tL
Tsmax
Tsmin
ts
Preheat
Ramp-down
25
t 25°C to Peak
Time
Classification Reflow Profiles
Profile Feature
Average ramp-up rate
(TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classificatioon Temperature (Tp)
Time within 5°C of actual
Peak Temperature (tp)
Ramp-down Rate
Time 25°C to Peak Temperature
Sn-Pb Eutectic Assembly
3°C/second max.
100°C
150°C
60-120 seconds
183°C
60-150 seconds
See table 1
10-30 seconds
6°C/second max.
6 minutes max.
Pb-Free Assembly
3°C/second max.
150°C
200°C
60-180 seconds
217°C
60-150 seconds
See table 2
20-40 seconds
6°C/second max.
8 minutes max.
Notes: All temperatures refer to topside of the package. Measured on the body surface.
Copyright © ANPEC Electronics Corp.
8
Rev. A.2 - Nov., 2006
www.anpec.com.tw

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