APL1187 View Datasheet(PDF) - Anpec Electronics
Part Name
Description
Manufacturer
APL1187 Datasheet PDF : 9 Pages
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APL1187
Classification Reflow Profiles (Cont.)
Table 1. SnPb Entectic Process – Package Peak Reflow Temperatures
Package Thickness
<2.5 mm
≥2.5 mm
Volume mm3
<350
240 +0/-5°C
225 +0/-5°C
Volume mm3
≥350
225 +0/-5°C
225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness
Volume mm3
<350
Volume mm3
350-2000
Volume mm3
>2000
<1.6 mm
260 +0°C*
260 +0°C*
260 +0°C*
1.6 mm – 2.5 mm
260 +0°C*
250 +0°C*
245 +0°C*
≥2.5 mm
250 +0°C*
245 +0°C*
245 +0°C*
* Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated
classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL
level.
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B,A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
Description
245°C, 5 SEC
1000 Hrs Bias @125°C
168 Hrs, 100%RH, 121°C
-65°C~150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms, 1tr > 100mA
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Fax : 886-2-89191369
Copyright © ANPEC Electronics Corp.
9
Rev. A.2 - Nov., 2006
www.anpec.com.tw
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