ASM0402C View Datasheet(PDF) - APLUS INTEGRATED CIRCUITS
Part Name
Description
Manufacturer
ASM0402C Datasheet PDF : 7 Pages
| |||
1.4 Bonding Diagram
ASM0402C
16K x 10 bit ROM
Y=1030+100 (um)
ASM0402C
CHIP SIZE: X= 1560+100(um) , Y= 1030+100(um)
1
2
3
4
5
6
7
X = 1560+100(um)
ASM0402C Pad Location
PAD # PAD Name
1 COUT
2 RA_PAD[1]
3 RA_PAD[0]/RESET
4 OSC_PAD
5 GND
X
-509.92
-203.2
-9.04
117.25
-347.6
Chip Size: X=1560+100 (um), Y=1030+100 (um)
Y PAD # PAD Name
X
Y
-430.32 6 TEST_PAD
507.6 -430.32
-430.32 7 VDD
677.52 -430.32
-430.32
-430.32
-430.32
5
Rev 1.0
Share Link: 