ASM0906CB View Datasheet(PDF) - APLUS INTEGRATED CIRCUITS
Part Name
Description
Manufacturer
ASM0906CB Datasheet PDF : 7 Pages
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1.4 Bonding Diagram
ASM0406CB/0906CB
32K x 10 bit ROM
ASM0406CB/0906CB
11
1
CHIP SIZE: X= 1550+80(um) , Y= 1360+80(um)
10
2
3
4
5
6
7
8
9
Substrate must be connected to GND.
ASM0406CB/0906CB Pad Location
PAD # PAD Name
X
1 RA3
-664.92
2 RA2
-664.92
3 RA1
-662.64
4 RA0
-468.24
5 OSC
-281.04
6 GND
-111.72
Chip Size: X= 1550 + 80 (um), Y=1360 + 80 (um)
Y PAD # PAD Name
X
Y
-275.52 7 TEST
105.44 -600.2
-403.64 8 COUT
303.96 -600.2
-600.2 9 VDD
683.04 -600.2
-600.2 10 RB0
664.92 -399.2
-600.2 11 RB1
664.92 -280.8
-600.2
5
Rev 1.0
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