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ASM0912CB View Datasheet(PDF) - APLUS INTEGRATED CIRCUITS

Part Name
Description
Manufacturer
ASM0912CB Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
1.4 Bonding Diagram
ASM0912CB
19
18
17 16 15
14 13
12
RC3 RC2 RC1 RC0 GND2 VDD2 TEST OSC
( 32K x 10-bit ) Block ROM
Y=1510+80 (um)
ASM0912CB
RA3 RA2 RA1 RA0 VDD1 COUT GND1 RB0
RB1 RB2 RB3
1
23 4
567
8
9
10
11
X= 1540+80 (um)
Substrate must be connected to GND.
ASM0912CB Pad Location
PAD # PAD Name
X
1 RA3
-682.16
2 RA2
-559.84
3 RA1
-437.52
4 RA0
-315.2
5 VDD1
-191.28
6 COUT
71.12
7 GND1
189.52
8 RB0
307.92
9 RB1
430.24
10 RB2
552.56
Chip Size: X= 1540+80
Y
PAD # PAD Name
-638.92 11 RB3
-638.92 12 OSC
-638.92 13 TEST
-638.92 14 VDD2
-638.92 15 GND2
-638.92 16 RC0
-638.92 17 RC1
-638.92 18 RC2
-638.92 19 RC3
-638.92
(um), Y=1510+80 (um)
X
Y
674.88
-638.92
633.56
670.24
432.48
670.24
273.16
670.24
134.68
670.24
-51.76
670.24
-248.4
670.24
-454.24
670.24
-650.88
670.24
5
Rev 1.0

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