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ASM4112C View Datasheet(PDF) - APLUS INTEGRATED CIRCUITS

Part Name
Description
Manufacturer
ASM4112C Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
1.4 Bonding Diagram
ASM3112C/4112C
19
18
17 16 15
14 13
12
RC3 RC2 RC1 RC0 GND2 VDD2 TEST OSC
( 128K x 10-bit ) Block ROM
ASM3112C/4112C
RA3 RA2 RA1 RA0 VDD1 COUT GND1 RB0
RB1 RB2 RB3
1
23 4
567
8
9
10
11
Substrate must be connected to GND.
ASM3112C/4112C Pad Location
PAD # PAD Name
X
1 RA3
-682.16
2 RA2
-559.84
3 RA1
-437.52
4 RA0
-315.2
5 VDD1
-191.28
6 COUT
71.12
7 GND1
189.52
8 RB0
307.92
9 RB1
430.24
10 RB2
552.56
Chip Size: X=1540+100
Y
PAD # PAD Name
-1040.2 11 RB3
-1040.2 12 OSC
-1040.2 13 TEST
-1040.2 14 VDD2
-1040.2 15 GND2
-1040.2 16 RC0
-1040.2 17 RC1
-1040.2 18 RC2
-1040.2 19 RC3
-1040.2
(um), Y=2320+100 (um)
X
Y
667.68
-1040.2
633.56
1071.52
432.48
1071.52
273.16
1071.52
134.68
1071.52
-51.76
1071.52
-248.4
1071.52
-454.24
1071.52
-650.88
1071.52
5
Rev 1.0

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