ASM5206C-1 View Datasheet(PDF) - APLUS INTEGRATED CIRCUITS
Part Name
Description
Manufacturer
ASM5206C-1 Datasheet PDF : 7 Pages
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1.4 Bonding Diagram
ASM5206C
160K x 10 bit ROM
Y= 2700+80(um)
1
2
ASM5206C
11
CHIP SIZE: X= 1550+80(um) , Y= 2700+80(um)
10
3
4
5
6
7
8
9
X= 1550+80(um)
Substrate must be connected to GND.
ASM5206C Pad Location
PAD # PAD Name
1 RA3
2 RA2
3 RA1
4 RA0
5 OSC
6 GND
CHIP SIZE: X= 1550+80(um) , Y= 2700+80(um)
X
Y PAD # PAD Name
X
Y
-664.92 -944.32 7 TEST_PAD
105.44 -1269
-664.92 -1072.44 8 COUT
303.96 -1269
-662.64 -1269 9 VDD
683.04 -1269
-468.24 -1269 10 RB0
664.92 -1068
-281.04 -1269 11 RB1
664.92 -949.6
-111.72 -1269
5
Rev 1.0
2002/09/22
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