AT25320B View Datasheet(PDF) - Atmel Corporation

Part Name

Description

Manufacturer

AT25320B

SPI Serial EEPROMs 32K (4096 x 8) 64K (8192 x 8)

Atmel Corporation 

4. AT25320B Ordering Information

Ordering Code

Voltage

Package

Operation Range

AT25320B-PU (Bulk form only)

AT25320BN-SH-B(1) (NiPdAu Lead Finish)

AT25320BN-SH-T(2) (NiPdAu Lead Finish)

AT25320B-TH-B(1) (NiPdAu Lead Finish)

AT25320B-TH-T(2) (NiPdAu Lead Finish)

AT25320BY6-YH-T(2) (NiPdAu Lead Finish)

1.8

8P3

1.8

8S1

1.8

8S1

1.8

8A2

1.8

8A2

1.8

8Y6

Lead-free/Halogen-free/

Industrial Temperature

(−40 to 85°C)

AT25320BD3-DH-T(2) (NiPdAu Lead Finish)

AT25320BU2-UU-T(2) (NiPdAu Lead Finish)

1.8

8D3

1.8

8U2-1

AT25320B-W-11(3)

1.8

Die Sale

Industrial Temperature

(−40 to 85°C)

Notes: 1. “B” denotes bulk.

2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini-MAP, SOT23, and dBGA2 = 5K per reel.

3. Available in waffle pack, tape and reel, and wafer form; order as SL788 for inkless wafer form. Bumped die available upon

request. Please contact Serial Interface Marketing.

8P3

8S1

8A2

8Y6

8D3

8U2-1

−1.8

Package Type

8-lead, 0.300” Wide, Plastic Dual Inline Package (PDIP)

8-lead, 0.150” Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)

8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)

8-lead, 1.8 mm x 2.2 mm Body, Ultra Leadframe Land Grid Array (ULA)

8-lead, 8.35 mm x 3.73 mm Body, 0.75 mm Pitch, VFBGA Package (dBGA2)

Options

Low Voltage (1.8 to 5.5V)

14 AT25320B/640B

8535B–SEEPR–7/08

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