APR6008 View Datasheet(PDF) - APLUS INTEGRATED CIRCUITS
Part Name
Description
Manufacturer
APR6008 Datasheet PDF : 23 Pages
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Figure 18 Bond Pad Layout and Coordinates
0
Origin
0
11 /R1E0SAENTA9OAUNT+AOUT-
12 VSSA
13 VSSA
14 VSSA
X Coordinate
15 AUDOUT
16 SQLCAP
17 / SQLOUT
18 ANAIN-
19 ANAIN+
20 VCCA
21 VCCA
* Connect substrate
to ground.
APR6008
8
NC
VSSD 6
VSSD 5
DO 4
DI 3
/CS 2
NC 1
SCLK 33
VCCD 32
VCCD 31
VCCD 30
EXTCLK 29
/INT 28
Table 7 Coordinate Information
Pad
Pad
X
Y
Number Name Coordinate Coordinate
1
NC
5149
2069
2
/CS
5149
1622
3
DI
5149
1243
4
DO
5149
901
5
VSSD
5149
610
6
VSSD
5149
383
7
NC
4795
108
8
NC
4412
108
9 ANAOUT-
560
108
10 ANAOUT+ 108
288
11 /RESET
373
108
12
VSSA
108
655
13
VSSA
108
827
14
VSSA
108
1113
15 AUDOUT
108
1426
16 SQLCAP
108
1834
17 /SQLOUT
108
2518
18
ANAIN-
108
2795
19 ANAIN+
108
3066
20
VCCA
108
3397
21
VCCA
108
3627
Page 21
Pad
Number
22
23
24
25
26
27
28
29
30
31
32
33
Pad
Name
NC
/BUSY
VSSA
VSSA
VSSA
SAC
/INT
EXTCLK
VCCD
VCCD
VCCD
SCLK
X
Y
Coordinate Coordinate
248
4106
548
4106
4314
4106
4486
4106
4658
4106
4906
4106
5149
3777
5149
3478
5149
2992
5149
2760
5149
2588
5149
2362
DIE SIZE : 4340µm x 5380µm
PAD SIZE : 100µm x 100µm
DIE THICKNESS : Approximately 25 mils
Voice Recording & Playback Device
Revision 2.1
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