AT89C51RC2(2002) View Datasheet(PDF) - Atmel Corporation

Part Name

Description

Manufacturer

AT89C51RC2
(Rev.:2002)

FLASH C51 Microcontrollers

Atmel Corporation 

AT89C51RB2 / RC2 & T89C51IC2 QualPack

4.2 Qualification test methods

General Requirements for Plastic packaged CMOS Ics.

Standard

MIL-STD 883

Method 1005

Test Description

Electrical Life Test (Early Failure Rate)

48 hours 140°C

MIL-STD 883

Method 1005

Electrical Life Test (Latent Failure Rate)

1000 hours 140°C Dynamic or Static

MIL-STD 883

Method 3015.7

Electrostatic Discharge HBM

+/-2000v 1.5kOhm/100pF/3 pulses

JEDEC 78

Latch up

50mW power injection, 50% overvoltage @125°C

AEC Q100

Method 005

NVM Endurance

Program Erase Cycles 25°C

AEC Q100

Method 005

NVM Data Retention

High Temperature Storage 165°C

MIL-STD 883

Method 1010

Temperature Cycling

1000 cycles -65°C/150°C air/air

Atmel

PAQA0184

HAST after Preconditioning

144 hours 130°C/85%RH

EIA

JESD22-A101

85/85 Humidity Test

1000 hours 85°C/85%RH

EIA

JESD22-A110

HAST

336 hours 130°C/85%RH/5.5V

EIA

JEDEC 20-STD

Preconditioning

Soldering Stress 220°C/235°c/3 times

MIL-STD 883

Method 2003

Solderability

MIL-STD 883

Method 2015

Marking Permanency

Acceptance

0/300 - 48h

0/100 - 500h

0/3 per level

0/5 per stress

0/50 - 100kc

0/50 - 500h

0/50 - 500c

0/50 - 72h

0/50 - 500h

0/50 - 168h

0/11 per class

0/3

0/5

Rev. 1 – 2002 June

8

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