1 Table of contents
AT89C51RB2 / RC2 & T89C51IC2 QualPack
1 TABLE OF CONTENTS ....................................................................................................................................................2
2 GENERAL INFORMATION.............................................................................................................................................3
3 TECHNOLOGY INFORMATION...................................................................................................................................4
3.1 WAFER PROCESS TECHNOLOGY ....................................................................................................................................4
3.2 PRODUCT DESIGN ..........................................................................................................................................................5
3.3 DEVICE CROSS SECTION .................................................................................................................................................6
4 QUALIFICATION ..............................................................................................................................................................7
4.1 QUALIFICATION METHODOLOGY....................................................................................................................................7
4.2 QUALIFICATION TEST METHODS.....................................................................................................................................8
4.3 WAFER LEVEL RELIABILITY ..........................................................................................................................................9
4.3.1 Electromigration.......................................................................................................................................................9
4.3.2 Hot carriers injection .............................................................................................................................................11
4.3.3 Time Dependent Dielectric Breakdown..................................................................................................................12
4.3.4 FLASH characteristics ...........................................................................................................................................14
4.3.4.1 Cell endurance .................................................................................................................................................................14
4.3.4.2 Cell retention ...................................................................................................................................................................15
4.3.4.3 Cell Read Disturb ............................................................................................................................................................16
4.3.4.4 Wafer probe Data retention measurement........................................................................................................................17
4.4 DEVICE RELIABILITY....................................................................................................................................................18
4.4.1 AT89C51RC2 tests..................................................................................................................................................18
4.4.2 AT89C51RC2 reliability calculation ......................................................................................................................19
4.5 PACKAGING RELIABILITY.............................................................................................................................................20
4.6 QUALIFICATION STATUS ..............................................................................................................................................20
5 ENVIRONMENTAL INFORMATION ..........................................................................................................................21
6 OTHER DATA ..................................................................................................................................................................22
6.1 ISO9001 AND QS9000 CERTIFICATES.........................................................................................................................22
6.2 DATA BOOK REFERENCE .............................................................................................................................................23
6.3 REVISION HISTORY......................................................................................................................................................23
Rev. 1 – 2002 June
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