AVXX08 View Datasheet(PDF) - APLUS INTEGRATED CIRCUITS
Part Name
Description
Manufacturer
AVXX08 Datasheet PDF : 10 Pages
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11. BONDING DIAGRAM:
AVxx08 Series
1
8
Y
2
7
3
4
5
6
( 0, 0 )
X
Chip size:
AVH308 : X=890 um, Y=680 um
AV0708 : X=890 um, Y=810 um
AV1408 : X=890 um, Y=1100 um
AV2108 : X=890 um, Y=1380 um
Pad size: 80 um x 80 um
※ The IC substrate must be connected to GND.
12. PAD LOCATION:
Pad No.
Pad Name
X
Y
1
IO1
87
307
2
TG1
87
197
3
GND1
53
69
4
PWM1
218
57
5
Vdd
445
57
6
PWM2
671
57
7
GND2
753
166
8
OSC
719
286
9
Rev 1.3 2003/9/18
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