AV1832D View Datasheet(PDF) - APLUS INTEGRATED CIRCUITS
Part Name
Description
Manufacturer
AV1832D Datasheet PDF : 13 Pages
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9. BONDING DIAGRAM:
AVxx32A Series
Chip size:
AV1232E: X=1120 um, Y=2480 um
AV1832D: X=1120 um, Y=2480 um
AV2432C: X=1120 um, Y=2480 um
Pad size: 80 um x 80 um
※ The IC substrate must be connected to GND.
10. PAD LOCATION:
Pad NO.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
Pad Name
Vdd1
OSC
COL4
COL3
COL2
COL1
ROW4
ROW3
ROW2
ROW1
OUT1
Vdd
OUT2
GND
GND1
OUT3
Test
MODE/STS4
AVxx32A Series
X
Y
293.4
2018.5
77.7
2012.8
-207.7
2012.8
-408.7
2012.8
-609.7
2012.8
-810.7
2012.8
-770.2
-1500.4
-770.2
-1708.4
-797.8
-2012.8
-589.8
-2012.8
-381.4
-2012.8
-106.5
-2018.5
165.3
-1906.8
391.2
-1906.8
536.2
-1906.8
762.1
-1906.8
806.5
2012.8
605.1
2012.8
13
Rev 1.0 2003/02/12
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