BD4153EFV-E2(2008) View Datasheet(PDF) - ROHM Semiconductor
Part Name
Description
Manufacturer
BD4153EFV-E2 Datasheet PDF : 17 Pages
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●APPRICATION CIRCUIT (CIRCUIT for ExpressCardTM Compliance Checklist)
BD4153FV
CPPE#(1)
CPPE#(11pin)
VCC(24pin)
CPUSB#(2)
CPUSB#(12pin) V3_IN(21,22pin)
3.3V(3)
V3(3,4pin)
V3AUX_IN(20pin)
3.3Vaux(4)
V3AUX(5pin)
V15_IN(17,18pin)
1.5V(5)
V15(8,9pin)
PERST_IN#(7pin)
PERST#(6)
VCC
PERST#(19pin)
EN(23pin)
OC(15pin)
SYSR(10pin)
OC_Delay(14pin)
SS_V3(2pin)
SS_V3AUX(6pin)
PERST#_Delay(13pin)
SS_V15(16pin)
GND(1pin)
3.3V(7)
3.3Vaux(8)
1.5V(9)
SysReset#(10)
●About heat loss
In designing heat, operate the apparatus within the following conditions.
(Because the following temperatures are warranted temperature, be sure to take margin, etc. into account.)
1. Ambient temperature Ta shall be not more than 125°C.
2. Chip junction temperature Tj shall be not more than 150°C.
Chip junction temperature Tj can be considered under the following two cases.
① Chip junction temperature Tj is found
②Chip junction temperature Tj is found from ambient temperature Ta:
from IC surface temperature TC under
Tj=TC+θj-a×W
actual application conditions:
Tj=TC+θj-c×W
＜Reference value＞
θj-c:SSOP-B24
HTSSOP-B24
33℃/W
36℃/W
＜Reference value＞
θj-a:SSOP-B24
243.9℃/W (IC only)
147.1℃/W Single-layer substrate
(substrate surface copper foil area: less 3%)
θj-a:HTSSOP-B24 113.6℃/W Single-layer substrate
(substrate surface copper foil area: less 3%)
73.5℃/W Double-layer substrate
(substrate surface copper foil area:15×15mm2)
44.6℃/W Double-layer substrate
(substrate surface copper foil area: 70×70mm2)
31.3℃/W Fourth-layer substrate
(substrate surface copper foil area: 70×70mm2)
Substrate size 70×70×1.6mm3 (thermal vias in the board.)
HTSSOP-B24 has thermal vias in the board. And
the board is connected with the exposed heatsink at
the bottom surface of the package by soldering.
Most of heat loss in BD4153FV occurs at the output switch. The power lost is determined by multiplying the on-resistance
by the square of output current of each switch. As BD4153EFV employs the power PKG, the thermal derating
characteristics significantly depends on the pc board conditions. When designing, care must be taken to the size of a pc
board to be used.
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