Q67000-S073(2003) View Datasheet(PDF) - Infineon Technologies
Part Name
Description
Manufacturer
Q67000-S073 Datasheet PDF : 9 Pages
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Parameter
Thermal characteristics
Thermal resistance,
junction - soldering point (pin 4)
SMD version, device on PCB
Symbol Conditions
BSP129
min.
Values
typ.
Unit
max.
R thJS
-
R thJA minimal footprint
-
6 cm2 cooling area1)
-
-
25 K/W
-
115
-
70
Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
Gate threshold voltage
Drain-source leakage current
Gate-source leakage current
Saturated drain current
Drain-source on-state resistance
Transconductance
V (BR)DSS V GS=-3 V, I D=250 µA
V GS(th) V DS=3 V, I D=108 µA
I D (off)
V DS=240 V,
V GS=-3 V, T j=25 °C
V DS=240 V,
V GS=-3 V, T j=125 °C
I GSS
V GS=20 V, V DS=0 V
I DSS
V GS=0 V, V DS=10 V
R DS(on) V GS=0 V, I D=25 mA
V GS=10 V, I D=0.35 A
g fs
|V DS|>2|I D|R DS(on)max,
I D=0.28 A
240
-2.1
-
-
-
50
-
-
0.18
-
-1.4
-
-
-
-
6.5
4.2
0.36
-V
-1
0.1 µA
10
10 nA
- mA
20 Ω
6.0
-S
1) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (single layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
Rev. 1.0
page 2
2003-03-28
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