BYG70 View Datasheet(PDF) - Philips Electronics
Part Name
Description
Manufacturer
BYG70 Datasheet PDF : 6 Pages
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Philips Semiconductors
Fast soft-recovery
controlled avalanche rectifiers
GRAPHICAL DATA
2.0
handbook, halfpage
IF(AV)
(A)
1.5
MGD485
handbook0, .h8alfpage
IF(AV)
(A)
0.6
Preliminary specification
BYG70 series
MGD486
1.0
0.4
0.5
0.2
0
0
100
VR = VRRMmax; δ = 0.5; a = 1.57.
200
Ttp (°C)
Fig.2 Maximum permissible average forward
current as a function of tie-point temperature
(including losses due to reverse leakage).
0
0
100
200
Tamb (°C)
VR = VRRMmax; δ = 0.5; a = 1.57.
Device mounted as shown in Fig.7;
solid line: Al2O3 PCB; dotted line: epoxy PCB.
Fig.3 Maximum permissible average forward
current as a function of ambient temperature
(including losses due to reverse leakage).
handboo2k,0h0alfpage
Tj
(°C)
160
120
80
D
40
0
0
MGD487
G
J
400
VR (V)
800
5
handbook, halfpage
IF
(A)
4
MGD488
3
2
1
0
0
2
4
6 VF (V) 8
Device mounted as shown in Fig.7.
Solid line: Al2O3 PCB.
Dotted line: epoxy PCB.
Fig.4 Maximum permissible junction temperature
as a function of reverse voltage.
Solid line: Tj = 25 °C.
Dotted line: Tj = 175 °C.
Fig.5 Forward current as a function of forward
voltage; maximum values.
1996 Jun 05
4
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