CNY17-1.3S View Datasheet(PDF) - Fairchild Semiconductor
Part Name
Description
Manufacturer
CNY17-1.3S Datasheet PDF : 14 Pages
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White Package (-M Suffix)
Package Dimensions (Through Hole)
0.350 (8.89)
0.320 (8.13)
Pin 1 ID
0.260 (6.60)
0.240 (6.10)
Package Dimensions (Surface Mount)
0.350 (8.89)
0.320 (8.13)
Pin 1 ID
0.390 (9.90)
0.260 (6.60) 0.332 (8.43)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.200 (5.08)
0.115 (2.93)
0.014 (0.36)
0.010 (0.25)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41)
0.100 (2.54)
0.320 (8.13)
15°
0.012 (0.30)
0.070 (1.77)
0.040 (1.02)
0.200 (5.08)
0.115 (2.93)
0.025 (0.63)
0.020 (0.51)
0.020 (0.50)
0.016 (0.41)
0.014 (0.36)
0.010 (0.25)
0.320 (8.13)
0.012 (0.30)
0.008 (0.20)
0.100 [2.54]
0.035 (0.88)
0.012 (0.30)
Package Dimensions (0.4” Lead Spacing)
0.350 (8.89)
0.320 (8.13)
PIN 1 ID
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41)
0.100 [2.54]
0.012 (0.30)
0.008 (0.21)
0.425 (10.80)
0.400 (10.16)
Recommended Pad Layout for
Surface Mount Leadform
(White Package Only)
0.070 (1.78)
0.060 (1.52)
0.425 (10.79)
0.100 (2.54)
0.305 (7.75)
0.030 (0.76)
NOTE
All dimensions are in inches (millimeters)
10
CNY17-1, CNY17-3, CNY17-2, CNY17-4 Rev. 1.0.2
www.fairchildsemi.com
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