CNY17-1-M.3SD View Datasheet(PDF) - Fairchild Semiconductor
Part Name
Description
Manufacturer
CNY17-1-M.3SD Datasheet PDF : 11 Pages
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PHOTOTRANSISTOR OPTOCOUPLERS
White Package (-M Suffix)
CNY17-1 CNY17-3
CNY17-2 CNY17-4
Package Dimensions (Through Hole)
0.350 (8.89)
0.320 (8.13)
Package Dimensions (Surface Mount)
0.350 (8.89)
0.320 (8.13)
0.260 (6.60)
0.240 (6.10)
0.260 (6.60)
0.240 (6.10)
0.390 (9.90)
0.332 (8.43)
0.070 (1.77)
0.040 (1.02)
0.200 (5.08)
0.115 (2.93)
0.014 (0.36)
0.010 (0.25)
0.320 (8.13)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41)
0.100 (2.54)
15°
0.012 (0.30)
Package Dimensions (0.4”Lead Spacing)
0.350 (8.89)
0.320 (8.13)
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41)
0.100 [2.54]
0.012 (0.30)
0.008 (0.21)
0.425 (10.80)
0.400 (10.16)
NOTE
All dimensions are in inches (millimeters)
0.070 (1.77)
0.040 (1.02)
0.200 (5.08)
0.115 (2.93)
0.025 (0.63)
0.020 (0.51)
0.020 (0.50)
0.016 (0.41)
0.014 (0.36)
0.010 (0.25)
0.320 (8.13)
0.012 (0.30)
0.008 (0.20)
0.100 [2.54]
0.035 (0.88)
0.006 (0.16)
Recommended Pad Layout for
Surface Mount Leadform
(White Package Only)
0.070 (1.78)
0.060 (1.52)
0.425 (10.79)
0.100 (2.54)
0.305 (7.75)
0.030 (0.76)
DS300208 6/06/01
9 OF 11
www.fairchildsemi.com
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