CNY174TM(2006) View Datasheet(PDF) - Fairchild Semiconductor
Part Name
Description
Manufacturer
CNY174TM Datasheet PDF : 15 Pages
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Black Package (No -M Suffix)
Package Dimensions (Through Hole)
PIN 1
ID.
0.270 (6.86)
0.240 (6.10)
0.070 (1.78)
0.045 (1.14)
0.350 (8.89)
0.330 (8.38)
0.200 (5.08)
0.115 (2.92)
0.154 (3.90)
0.100 (2.54)
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
TYP
0.020 (0.51)
MIN
0.016 (0.40)
0.008 (0.20)
0° to 15°
0.300 (7.62)
TYP
Package Dimensions (0.4” Lead Spacing)
PIN 1 ID
0.270 (6.86)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.135 (3.43)
0.154 (3.90)
0.100 (2.54)
0.022 (0.56)
0.016 (0.41)
0.004 (0.10)
MIN
0.100 (2.54) TYP
0.016 (0.40)
0.008 (0.20)
0° to 15°
0.400 (10.16)
TYP
Note:
All dimensions are in inches (millimeters)
Package Dimensions (Surface Mount)
0.350 (8.89)
0.330 (8.38)
3
2
1
PIN 1
ID.
0.270 (6.86)
0.240 (6.10)
4
5
6
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.165 (4.18)
0.022 (0.56)
0.016 (0.41)
0.020 (0.51)
MIN
0.100 (2.54)
TYP
Lead Coplanarity : 0.004 (0.10) MAX
0.300 (7.62)
TYP
0.016 (0.40) MIN
0.315 (8.00)
MIN
0.405 (10.30)
MAX
0.016 (0.41)
0.008 (0.20)
Recommended Pad Layout for Surface Mount
Leadform (Black Package Only)
0.070 (1.78)
0.060 (1.52)
0.415 (10.54)
0.100 (2.54)
0.295 (7.49)
0.030 (0.76)
10
CNY17X, CNY17FX, MOC810X Rev. 1.0.6
www.fairchildsemi.com
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