CNY173TM(2006) View Datasheet(PDF) - Fairchild Semiconductor

Part Name

Description

Manufacturer

CNY173TM
(Rev.:2006)

Phototransistor Optocouplers

Fairchild Semiconductor 

White Package (-M Suffix)

Package Dimensions (Through Hole)

0.350 (8.89)

0.320 (8.13)

Pin 1 ID

0.260 (6.60)

0.240 (6.10)

0.070 (1.77)

0.040 (1.02)

0.200 (5.08)

0.115 (2.93)

0.014 (0.36)

0.010 (0.25)

0.100 (2.54)

0.015 (0.38)

0.020 (0.50)

0.016 (0.41)

0.100 (2.54)

0.320 (8.13)

15°

0.012 (0.30)

Package Dimensions (0.4” Lead Spacing)

0.350 (8.89)

0.320 (8.13)

PIN 1 ID

0.260 (6.60)

0.240 (6.10)

0.070 (1.77)

0.040 (1.02)

0.014 (0.36)

0.010 (0.25)

0.200 (5.08)

0.115 (2.93)

0.100 (2.54)

0.015 (0.38)

0.020 (0.50)

0.016 (0.41)

0.100 [2.54]

0.012 (0.30)

0.008 (0.21)

0.425 (10.80)

0.400 (10.16)

Note:

All dimensions are in inches (millimeters)

Package Dimensions (Surface Mount)

0.350 (8.89)

0.320 (8.13)

Pin 1 ID

0.390 (9.90)

0.260 (6.60) 0.332 (8.43)

0.240 (6.10)

0.070 (1.77)

0.040 (1.02)

0.200 (5.08)

0.115 (2.93)

0.014 (0.36)

0.010 (0.25)

0.320 (8.13)

0.012 (0.30)

0.008 (0.20)

0.025 (0.63)

0.020 (0.51)

0.020 (0.50)

0.016 (0.41)

0.100 [2.54]

0.035 (0.88)

0.012 (0.30)

Recommended Pad Layout for Surface Mount

Leadform (White Package Only)

0.070 (1.78)

0.060 (1.52)

0.425 (10.79)

0.100 (2.54)

0.305 (7.75)

0.030 (0.76)

11

CNY17X, CNY17FX, MOC810X Rev. 1.0.6

www.fairchildsemi.com

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