CS495303(2008) View Datasheet(PDF) - Cirrus Logic
Part Name
Description
Manufacturer
CS495303 Datasheet PDF : 34 Pages
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5.4 Power Supply Characteristics
(measurements performed under operating conditions)
Parameter
Power supply current:
Core and I/O operating: VDD1
PLL operating: VDDA
With external memory and most ports operating: VDDIO
1. Dependent on application firmware and DSP clock speed.
CS4953xx Data Sheet
32-bit Audio Decoder DSP Family
Min
Typ
Max
Unit
-
500
-
mA
-
3.5
-
mA
-
120
-
mA
5.5 Thermal Data (144 LQFP)
Parameter
Symbol Min
Typ
Max
Unit
Thermal Resistance (Junction to Ambient)
θja
°C / Watt
Two-layer Board1
Four-layer Board2
Thermal Resistance (Junction to Top of Package)
ψjt
Two-layer Board1
Four-layer Board2
-
48
-
-
40
-
°C / Watt
-
.39
-
-
.33
-
Y 5.6 Thermal Data (128 LQFP)
Parameter
Symbol Min
Typ
Max
Unit
R Thermal Resistance (Junction to Ambient)
θja
°C / Watt
Two-layer Board1
-
53
-
A Four-layer Board2
-
44
-
Thermal Resistance (Junction to Top of Package)
ψjt
Two-layer Board1
Four-layer Board2
°C / Watt
-
.45
-
-
.39
-
IN Notes: 1.
2.
IM 3.
4.
5.
L 6.
Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz copper covering 20 %
of the top & bottom layers.
Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz copper covering 20 %
of the top & bottom layers and 0.5-oz copper covering 90 % of the internal power plane and ground plane layers.
To calculate the die temperature for a given power dissipation
Τj = Ambient Temperature + [ (Power Dissipation in Watts) * θja ]
To calculate the case temperature for a given power dissipation
Τc = Τj - [ (Power Dissipation in Watts) * ψ jt ]
5.7 Switching Characteristics— RESET
EParameter
RESET# minimum pulse width low
R All bidirectional pins high-Z after RESET# low
Configuration pins setup before RESET# high
PConfiguration pins hold after RESET# high
Symbol
Trstl
Trst2z
Trstsu
Trsthld
Min
1
-
50
20
Max
-
100
-
-
Unit
μs
ns
ns
ns
DS705PP3
Copyright 2008 Cirrus Logic
11
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