Vcc 2
Vc 8
GND 1
Photodiode
High
×3
6 Vout
3 SW
Low
5
Vin1
4
Vin2
VR1
VR2
7
IVout
I Figure 1 CXA2676GA Block Diagram
7 IVout
Vin1 5
SW 3
1 GND
Vc 8
6 Vout
4 Vin2
Vcc 2
I Figure 3 CXA2676GA Pin
Configuration
Go Do Co Eo RF–
12 13 14 15 16
Vc SW RF+
9 10 11
Vcc WPP2 WPP1
678
12345
GND Ho Ao Bo Fo
I Figure 4 CXA2677GA Pin
Configuration
Ao 3
A'
×3
Bo 4
B'
×3
Co 14
C'
×3
Do 13
D'
×3
Eo 15 ×3.5
Fo 5 ×3.5
Go 12 ×3.5
Ho 2 ×3.5
A
Vc
B
Vc
C
Vc
D
Vc
E
Vc
F
Vc
G
Vc
H
Vc
Vc
Ao
Bo
Co
Do
Ao
Bo
Co
Do
Vcc
Vc
Vc
B'
C'
Vc
A'
D'
6 Vcc
9 Vc
1 GND
10 SW
11 RF+
16 RF–
8 WPP1
7 WPP2
I Figure 2 CXA2677GA Block Diagram
φ0.7 mm
Photosensitive area position:
At the package center
I Figure 5 CXA2676GA Acceptance Pattern Dimensions
Top view
4.5 ±0.1
Acceptance area
Bottom view
1.6
Chip
Transparent resin
(includes scattering materials)
0.8
Unit: mm
Back side contact
(LGA)
Substrate
I Figure 7 CXA2676GA Package Dimensions
120 35 120 35 120
HG
DC
AB
FE
Unit: µm
I Figure 6 CXA2677GA Acceptance Pattern Dimensions
Top view
4.5 ±0.1
Bottom view
DC
HG A B F E
Colorless transparent resin
Chip
0.8
Unit: mm
Back side contact
(LGA)
Substrate
I Figure 8 CXA2677GA Package Dimensions
11