CXK5T8257BTM View Datasheet(PDF) - Sony Semiconductor

Part Name

Description

Manufacturer

CXK5T8257BTM

32768-word × 8-bit High Speed CMOS Static RAM

Sony Semiconductor 

CXK5T8257BTM/BYM/BM

• Read cycle (WE = “H”)

VCC = 2.7 to 3.6V

VCC = 3.3V ± 0.3V

Item

Symbol -10LLX

-12LLX

-10LLX

-12LLX Unit

Min. Max. Min. Max. Min. Max. Min. Max.

Read cycle time

tRC

100 — 120 — 85 — 100 —

Address access time

tAA

— 100 — 120 — 85 — 100

Chip enable access time (CE)

tCO

— 100 — 120 — 85 — 100

Chip enable to output valid

tOE

— 50 — 60 — 50 — 50

Chip hold from address change

tOH

20 — 20 — 20 — 20 — ns

Chip enable to output in low Z (CE)

tLZ

10 — 10 — 10 — 10 —

Output enable to output in low Z (OE) tOLZ 10 — 10 — 10 — 10 —

Chip disable to output in high Z (CE) tHZ∗1 — 35 — 40 — 35 — 35

Output disable to output in high Z (OE) tOHZ∗1 — 35 — 35 — 35 — 35

∗1 tHZ and tOHZ are defined as the time required for outputs to turn to high impedance state and are not referred

to as output voltage levels.

• Write cycle

VCC = 2.7 to 3.6V

VCC = 3.3V ± 0.3V

Item

Symbol -10LLX

-12LLX

-10LLX

-12LLX Unit

Min. Max. Min. Max. Min. Max. Min. Max.

Write cycle time

tWC 100 — 120 — 85 — 100 —

Address valid to end of write

tAW

80 — 100 — 80 — 80 —

Chip enable to end of write

tCW

80 — 100 — 80 — 80 —

Data to write time overlap

tDW

35 — 50 — 35 — 35 —

Data hold from write time

tDH

0—0— 0—0—

Write pulse width

tWP

60 — 70 — 60 — 60 — ns

Address setup time

tAS

0—0— 0—0—

Write recovery time (WE)

tWR

0—0— 0—0—

Write recovery time (CE)

tWR1

0—

0—

0—0—

Output active from end of write

Write to output in high Z

tOW

10 — 10 — 10 — 10 —

tWHZ∗2 — 35 — 40 — 35 — 35

∗2 tWHZ is defined as the time requied for outputs to turn to high impedance state and is not referred to as

output voltage level.

–5–

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