CY62136CV View Datasheet(PDF) - Cypress Semiconductor
Part Name
Description
Manufacturer
CY62136CV Datasheet PDF : 13 Pages
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CY62136CV30/33 MoBL
CY62136CV MoBL
Thermal Resistance
Parameter
Description
ΘJA
Thermal Resistance
(Junction to Ambient)[6]
ΘJC
Thermal Resistance
(Junction to Case)[6]
Test Conditions
Still Air, soldered on a 3 x 4.5 inch, two-layer printed
circuit board
BGA
55
16
Unit
°C/W
°C/W
AC Test Loads and Waveforms
R1
VCC
OUTPUT
30 pF
INCLUDING
JIG AND
SCOPE
ALL INPUT PULSES
VCC Typ
10%
90%
R2
GND
Rise TIme: 1 V/ns
90%
10%
Fall Time: 1 V/ns
Equivalent to:
THÉVENIN EQUIVALENT
OUTPUT
RTH
VTH
Parameters
R1
R2
RTH
VTH
3.0V
1105
1550
645
1.75
3.3V
1216
1374
645
1.75
Data Retention Characteristics (Over the Operating Range)
Parameter
VDR
ICCDR
tCDR[6]
tR[7]
Description
VCC for Data Retention
Data Retention Current
Chip Deselect to Data
Retention Time
Operation Recovery Time
Conditions
VCC= 1.5V CE > VCC – 0.2V,
VIN > VCC – 0.2V or VIN < 0.2V
Min.
1.5
0
tRC
Data Retention Waveform
Unit
Ω
Ω
Ω
V
Typ.[5]
1
Max.
Vccmax
6
DATA RETENTION MODE
VCC
VCC(min)
VDR > 1.5 V
VCC(min)
tCDR
tR
CE
Unit
V
µA
ns
ns
Notes:
6. Tested initially and after any design or process changes that may affect these parameters.
7. Full Device AC operation requires linear VCC ramp from VDR to VCC(min.) > 100 µs or stable at VCC(min.) > 100 µs.
Document #: 38-05199 Rev. *D
Page 4 of 13
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