CY7C1020B-12VXC View Datasheet(PDF) - Cypress Semiconductor
Part Name
Description
Manufacturer
CY7C1020B-12VXC Datasheet PDF : 9 Pages
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CY7C1020B
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature ................................. –65°C to +150°C
Current into Outputs (LOW)......................................... 20 mA
Static Discharge Voltage............................................ >2001V
(per MIL-STD-883, Method 3015)
Latch-Up Current ..................................................... >200 mA
Ambient Temperature with
Power Applied............................................. –55°C to +125°C
Supply Voltage on VCC Relative to GND[1] .... –0.5V to +7.0V
DC Voltage Applied to Outputs
in High Z State[1] ....................................–0.5V to VCC + 0.5V
DC Input Voltage[1].................................–0.5V to VCC + 0.5V
Electrical Characteristics Over the Operating Range
Operating Range
Range
Commercial
Ambient
Temperature[2]
0°C to +70°C
VCC
5V ± 10%
Parameter
Description
Test
Conditions
CY7C1020B-12 CY7C1020B-15
Min. Max. Min. Max. Unit
VOH
Output HIGH Voltage
VCC = Min.,
IOH = –4.0 mA
2.4
2.4
V
VOL
Output LOW Voltage
VCC = Min.,
IOL = 8.0 mA
0.4
0.4
V
VIH
Input HIGH Voltage
VIL
Input LOW Voltage[1]
2.2
6.0
2.2
6.0
V
–0.5
0.8
–0.5
0.8
V
IIX
Input Leakage Current
GND < VI < VCC
–1
+1
–1
+1 µA
IOZ
Output Leakage Current
GND < VI < VCC, Output Disabled –1
+1
–1
+1 µA
IOS
Output Short Circuit Current[3] VCC = Max., VOUT = GND
–300
–300 mA
ICC
VCC Operating
Supply Current
VCC = Max., IOUT = 0 mA,
f = fMAX = 1/tRC
140
130 mA
ISB1
Automatic CE Power-Down Max. VCC, CE > VIH
Current—TTL Inputs
VIN > VIH or VIN < VIL, f = fMAX
20
20 mA
ISB2
Automatic CE Power-Down Max. VCC, CE > VCC – 0.3V,
Current—CMOS Inputs
VIN > VCC – 0.3V,
or VIN < 0.3V, f = 0
3
3
mA
Capacitance[4]
Parameter
CIN
COUT
Description
Input Capacitance
Output Capacitance
Test Conditions
TA = 25°C, f = 1 MHz,
VCC = 5.0V
Max.
Unit
8
pF
8
pF
Thermal Resistance[4]
Parameter
Description
Test Conditions
TSOP II
Package
ΘJA
Thermal Resistance
Still Air, soldered on a 3 × 4.5 inch,
(Junction to Ambient)
four-layer printed circuit board
50.55
ΘJC
Thermal Resistance
15.8
(Junction to Case)
Notes:
1. VIL (min.) = –2.0V for pulse durations of less than 20 ns.
2. TA is the case temperature.
3. Not more than one output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds.
4. Tested initially and after any design or process changes that may affect these parameters.
SOJ
Package
56.31
32.9
Unit
°C/W
°C/W
Document #: 38-05171 Rev. *C
Page 2 of 9
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