CY7C1327G(2006) View Datasheet(PDF) - Cypress Semiconductor
Part Name
Description
Manufacturer
CY7C1327G Datasheet PDF : 18 Pages
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CY7C1327G
Pin Definitions
Name
I/O
Description
A0, A1, A
Input- Address Inputs used to select one of the 256K address locations. Sampled at the rising edge of
Synchronous the CLK if ADSP or ADSC is active LOW, and CE1, CE2, and CE3 are sampled active. A1, A0 feed
the 2-bit counter.
BWA, BWB
Input- Byte Write Select Inputs, active LOW. Qualified with BWE to conduct byte writes to the SRAM.
Synchronous Sampled on the rising edge of CLK.
GW
BWE
Input- Global Write Enable Input, active LOW. When asserted LOW on the rising edge of CLK, a global
Synchronous write is conducted (ALL bytes are written, regardless of the values on BW[A:B] and BWE).
Input- Byte Write Enable Input, active LOW. Sampled on the rising edge of CLK. This signal must be
Synchronous asserted LOW to conduct a byte write.
CLK
Input- Clock Input. Used to capture all synchronous inputs to the device. Also used to increment the burst
Clock counter when ADV is asserted LOW, during a burst operation.
CE1
Input- Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE2
Synchronous and CE3 to select/deselect the device. ADSP is ignored if CE1 is HIGH. CE1 is sampled only when a
new external address is loaded.
CE2
Input- Chip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction with
Synchronous CE1 and CE3 to select/deselect the device. CE2 is sampled only when a new external address is
loaded.
CE3
Input- Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE1
Synchronous and CE2 to select/deselect the device. Not connected for BGA. Where referenced, CE3 is assumed
active throughout this document for BGA. CE3 is sampled only when a new external address is loaded.
OE
Input- Output Enable, asynchronous input, active LOW. Controls the direction of the I/O pins. When
Asynchronous LOW, the I/O pins behave as outputs. When deasserted HIGH, I/O pins are tri-stated, and act as input
data pins. OE is masked during the first clock of a read cycle when emerging from a deselected state.
ADV
Input- Advance Input signal, sampled on the rising edge of CLK, active LOW. When asserted, it
Synchronous automatically increments the address in a burst cycle.
ADSP
Input- Address Strobe from Processor, sampled on the rising edge of CLK, active LOW. When
Synchronous asserted LOW, A is captured in the address registers. A1, A0 are also loaded into the burst counter.
When ADSP and ADSC are both asserted, only ADSP is recognized. ASDP is ignored when CE1 is
deasserted HIGH.
ZZ
Input- ZZ “sleep” Input, active HIGH. This input, when High places the device in a non-time-critical “sleep”
Asynchronous condition with data integrity preserved. During normal operation, this pin has to be low or left floating.
ZZ pin has an internal pull-down.
ADSC
Input- Address Strobe from Controller, sampled on the rising edge of CLK, active LOW. When asserted
Synchronous LOW, A is captured in the address registers. A1, A0 are also loaded into the burst counter. When
ADSP and ADSC are both asserted, only ADSP is recognized.
DQA, DQB
DQPA,
DQPB
I/O-
Bidirectional Data I/O lines. As inputs, they feed into an on-chip data register that is triggered by
Synchronous the rising edge of CLK. As outputs, they deliver the data contained in the memory location specified
by “A” during the previous clock rise of the read cycle. The direction of the pins is controlled by OE.
When OE is asserted LOW, the pins behave as outputs. When HIGH, DQs and DQP[A:B] are placed
in a tri-state condition.
VDD
VSS
VDDQ
MODE
Power Supply Power supply inputs to the core of the device.
Ground Ground for the device.
I/O Ground Ground for the I/O circuitry.
Input-
Static
Selects Burst Order. When tied to GND selects linear burst sequence. When tied to VDD or left
floating selects interleaved burst sequence. This is a strap pin and should remain static during device
operation. Mode Pin has an internal pull-up.
NC,NC/9M,
–
No Connects. Not internally connected to the die. NC/9M,NC/18M,NC/72M, NC/144M, NC/288M,
NC/18M.
NC/576M and NC/1G are address expansion pins are not internally connected to the die.
NC/72M,
NC/144M,
NC/288M,
NC/576M,
NC/1G
Document #: 38-05519 Rev. *F
Page 4 of 18
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