TDA7391PD View Datasheet(PDF) - STMicroelectronics
Part Name
Description
Manufacturer
TDA7391PD Datasheet PDF : 11 Pages
| |||
TDA7391PD
4
Package information
Package information
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®
packages. ECOPACK® packages are lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 14. PowerSO-20 mechanical data and package dimensions
mm
inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A
3.6
0.142
a1 0.1
0.3 0.004
0.012
a2
3.3
0.130
a3
0
0.1 0.000
0.004
b
0.4
0.53 0.016
0.021
c 0.23
0.32 0.009
0.013
D (1) 15.8
16 0.622
0.630
D1 (2) 9.4
9.8 0.370
0.386
E 13.9
14.5 0.547
0.570
e
1.27
0.050
e3
11.43
0.450
E1 (1) 10.9
11.1 0.429
0.437
E2
2.9
0.114
E3 5.8
6.2 0.228
0.244
G
0
0.1 0.000
0.004
H 15.5
15.9 0.610
0.626
h
1.1
0.043
L
0.8
1.1 0.031
0.043
N
8˚(typ.)
S
8˚(max. )
T
10
0.394
(1) “D and E1” do not include mold flash or protusions.
- Mold flash or protusions shall not exceed 0.15mm (0.006”)
- Critical dimensions: “E”, “G” and “a3”.
(2) For subcontractors, the limit is the one quoted in jedec MO-166
OUTLINE AND
MECHANICAL DATA
Weight: 1.9gr
JEDEC MO-166
PowerSO-20
N
N
b
DETAIL A
e3
H
R
a2 A
e
DETAIL B
E
lead
c
a1
DETAIL A
20
E2
1
h x 45˚
D
T
1
a3
slug
DETAIL B
11
0.35
Gage Plane
-C-
S
L
SEATING PLANE
GC
E1
BOTTOM VIEW
(COPLANARITY)
0
PSO20MEC
E3
D1
0056635 I
9/11
Share Link: 