DG3015 View Datasheet(PDF) - Vishay Semiconductors

Part Name

Description

Manufacturer

DG3015

Low-Voltage, Low RON, Dual DPDT Analog Switch

Vishay Semiconductors 

Package Information

Vishay Siliconix

MICRO FOOT: 16-BUMP (4 mm x 4 mm, 0.5 mm PITCH, 0.238 mm BUMP HEIGHT)

6 X Ø 0.150 ~ 0.229

Note b

Solder Mask Ø ~ Pad Diameter + 0.1

A

A2

0.5

A1

4

3

2

1

0.5

b Diameter

Recommended Land Pattern

e

Index-Bump A1

Note c

e

XXX

3408

e

Top Side (Die Back)

S

S

e

e

e

D

Notes

(unless otherwise specified)

a. Bump is lead (Pb)-free Sn/Ag/Cu.

b. Non-solder mask defined copper landing pad.

c. Laser mark on silicon die back; back-lapped, no coating. Shown is not actual marking; sample only.

Silicon

Bump

Note a

A

B

E

C

D

DIM.

A

A1

A2

b

D

E

e

S

MIN.

0.688

0.218

0.470

0.306

1.980

1.980

0.230

MILLIMETERSa

0.5 BASIC

Note

a. Use millimeters as the primary measurement.

MAX.

0.753

0.258

0.495

0.346

2.020

2.020

0.270

MIN.

0.0271

0.0086

0.0185

0.0120

0.0780

0.0780

0.0091

INCHES

0.0197 BASIC

MAX.

0.0296

0.0102

0.0195

0.0136

0.0795

0.0795

0.0106

ECN: S11-1065-Rev. A, 13-Jun-11

DWG: 6000

Document Number: 63273

Revision: 13-Jun-11

www.vishay.com

1

This document is subject to change without notice.

THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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