DSP56309/D View Datasheet(PDF) - Motorola => Freescale
Part Name
Description
Manufacturer
DSP56309/D Datasheet PDF : 112 Pages
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Freescale Semiconductor, Inc.
Table of Contents
Chapter 1
Chapter 2
Chapter 3
Chapter 4
Appendix A
Index
DSP56309 Features............................................................................................................................................ iii
Target Applications ............................................................................................................................................ iv
Product Documentation...................................................................................................................................... iv
Signal Connections
1.1 Signal Groupings.............................................................................................................................................. 1-1
1.2 Power................................................................................................................................................................ 1-3
1.3 Ground.............................................................................................................................................................. 1-3
1.4 Clock ................................................................................................................................................................ 1-4
1.5 PLL................................................................................................................................................................... 1-4
1.6 External Memory Expansion Port (Port A)...................................................................................................... 1-5
1.7 Interrupt and Mode Control ............................................................................................................................. 1-8
1.8 Host Interface (HI08) ....................................................................................................................................... 1-9
1.9 Enhanced Synchronous Serial Interface 0 (ESSI0)........................................................................................ 1-13
1.10 Enhanced Synchronous Serial Interface 1 (ESSI1)........................................................................................ 1-14
1.11 Serial Communication Interface (SCI)........................................................................................................... 1-16
1.12 Timers............................................................................................................................................................. 1-17
1.13 JTAG and OnCE Interface ............................................................................................................................. 1-18
Specifications
2.1 Introduction ...................................................................................................................................................... 2-1
2.2 Maximum Ratings............................................................................................................................................ 2-1
2.4 Thermal Characteristics ................................................................................................................................... 2-2
2.5 DC Electrical Characteristics ........................................................................................................................... 2-3
2.6 AC Electrical Characteristics ........................................................................................................................... 2-4
Packaging
3.1 Pin-Out and Packages ...................................................................................................................................... 3-1
3.2 TQFP Package.................................................................................................................................................. 3-2
3.3 TQFP Package Mechanical Drawing ............................................................................................................... 3-9
3.4 MAP-BGA Package ....................................................................................................................................... 3-10
3.5 MAP-BGA Package Mechanical Drawing .................................................................................................... 3-19
Design Considerations
4.1 Thermal Design Considerations....................................................................................................................... 4-1
4.2 Electrical Design Considerations ..................................................................................................................... 4-2
4.3 Power Consumption Considerations ................................................................................................................ 4-4
4.4 PLL Performance Issues .................................................................................................................................. 4-5
4.5 Input (EXTAL) Jitter Requirements................................................................................................................. 4-5
Power Consumption Benchmark
Data Sheet Conventions
OVERBAR
Indicates a signal that is active when pulled low (For example, the RESET pin is active when low.)
“asserted”
Means that a high true (active high) signal is high or that a low true (active low) signal is low
“deasserted”
Means that a high true (active high) signal is low or that a low true (active low) signal is high
Examples:
Signal/Symbol
Logic State
Signal State
Voltage
PIN
True
Asserted
PIN
False
Deasserted
PIN
True
Asserted
PIN
False
Deasserted
Note: Values for VIL, VOL, VIH, and VOH are defined by individual product specifications.
VIL/VOL
VIH/VOH
VIH/VOH
VIL/VOL
ii
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