DSP56311/D View Datasheet(PDF) - Motorola => Freescale
Part Name
Description
Manufacturer
DSP56311/D Datasheet PDF : 100 Pages
| |||
Thermal Characteristics
Table 2-1. Absolute Maximum Ratings
Rating1
Symbol
Value1, 2
Unit
Supply Voltage
VCC
–0.1 to 2.0
V
Input/Output Supply Voltage
VCCQH
–0.3 to 4.0
V
All input voltages
VIN
GND – 0.3 to VCCQH + 0.3
V
Current drain per pin excluding VCC and GND
I
10
mA
Operating temperature range
TJ
–40 to +100
°C
Storage temperature
TSTG
–55 to +150
°C
Notes: 1. GND = 0 V, VCC = 1.8 V ± 0.1 V, VCCQH = 3.3 V ± 0.3 V, TJ = –40°C to +100°C, CL = 50 pF
2. Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not
guaranteed. Stress beyond the maximum rating may affect device reliability or cause permanent
damage to the device.
3. Power-up sequence: During power-up, and throughout the DSP56311 operation, VCCQH voltage must
always be higher or equal to VCC voltage.
2.3 Thermal Characteristics
Table 2-2. Thermal Characteristics
Characteristic
Symbol
MAP-BGA
Value
Unit
Junction-to-ambient, natural convection, single-layer board (1s)1,2
Junction-to-ambient, natural convection, four-layer board (2s2p)1,3
Junction-to-ambient, @200 ft/min air flow, single layer board (1s)1,3
Junction-to-ambient, @200 ft/min air flow, four-layer board (2s2p)1,3
Junction-to-board4
Junction-to-case thermal resistance5
Junction-to-package-top, natural convection6
Junction-to-package-top, @200 ft/min air flow6
RθJA
RθJMA
RθJMA
RθJMA
RθJB
RθJC
ΨJT
ΨJT
49
°C/W
26
°C/W
39
°C/W
22
°C/W
14
°C/W
5
°C/W
2
°C/W
2
°C/W
Notes: 1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the
board, and board thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
5. Indicates the average thermal resistance between the die and the case top surface as measured by the
cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case
temperature.
6. Thermal characterization parameter indicating the temperature difference between package top and
the junction temperature per JEDEC JESD51-2.
2-2
Share Link: 