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DSP56364 View Datasheet(PDF) - Motorola => Freescale

Part Name
Description
Manufacturer
DSP56364
Motorola
Motorola => Freescale Motorola
DSP56364 Datasheet PDF : 162 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Freescale Semiconductor, Inc.
Signal/Connection Descriptions
Ground
1.3 GROUND
Table 1-3 Grounds
Ground
Name
GNDP
GNDQ (4)
GNDA (4)
GNDD (1)
GNDC (1)
GNDS (3)
Description
PLL Ground—GNDP is ground-dedicated for PLL use. The connection should be pro-
vided with an extremely low-impedance path to ground. VCCP should be bypassed to
GNDP by a 0.47 µF capacitor located as close as possible to the chip package. There is
one GNDP connection.
Quiet Ground—GNDQ is an isolated ground for the internal processing logic. This con-
nection must be tied externally to all other chip ground connections. The user must pro-
vide adequate external decoupling capacitors. There are four GNDQ connections.
Address Bus Ground—GNDA is an isolated ground for sections of the address bus
I/O drivers. This connection must be tied externally to all other chip ground connec-
tions. The user must provide adequate external decoupling capacitors. There are four
GNDA connections.
Data Bus Ground—GNDD is an isolated ground for sections of the data bus
I/O drivers. This connection must be tied externally to all other chip ground connec-
tions. The user must provide adequate external decoupling capacitors. There is one
GNDD connections.
Bus Control Ground—GNDC is an isolated ground for the bus control I/O drivers. This
connection must be tied externally to all other chip ground connections. The user must
provide adequate external decoupling capacitors. There is one GNDC connections.
SHI and ESAI —GNDS is an isolated ground for the SHI and ESAI. This connection
must be tied externally to all other chip ground connections. The user must provide
adequate external decoupling capacitors. There are three GNDS connections.
1-4
DSP56364 Advance Information
MOTOROLA
For More Information On This Product,
Go to: www.freescale.com

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