DSP56303UM View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
Manufacturer
DSP56303UM Datasheet PDF : 108 Pages
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Table of Contents
Chapter 1
Chapter 2
Chapter 3
Chapter 4
Data Sheet Conventions .......................................................................................................................................ii
Features ...............................................................................................................................................................iii
Target Applications ............................................................................................................................................. iv
Product Documentation ......................................................................................................................................iv
Signals/Connections
1.1
Power ................................................................................................................................................................1-3
1.2
Ground ..............................................................................................................................................................1-3
1.3
Clock .................................................................................................................................................................1-4
1.5
External Memory Expansion Port (Port A) ......................................................................................................1-4
1.6
Interrupt and Mode Control ..............................................................................................................................1-7
1.7
Host Interface (HI08)........................................................................................................................................1-8
1.8
Enhanced Synchronous Serial Interface 0 (ESSI0) ........................................................................................1-11
1.9
Enhanced Synchronous Serial Interface 1 (ESSI1) ........................................................................................1-12
1.10 Serial Communication Interface (SCI) ...........................................................................................................1-14
1.11 Timers .............................................................................................................................................................1-15
1.12 JTAG and OnCE Interface ..............................................................................................................................1-16
Specifications
2.1
Maximum Ratings.............................................................................................................................................2-1
2.3
Thermal Characteristics ....................................................................................................................................2-2
2.4
DC Electrical Characteristics............................................................................................................................2-2
2.5
AC Electrical Characteristics............................................................................................................................2-3
Packaging
3.1
TQFP Package Description...............................................................................................................................3-2
3.2
TQFP Package Mechanical Drawing................................................................................................................3-9
3.3
MAP-BGA Package Description ....................................................................................................................3-10
3.4
MAP-BGA Package Mechanical Drawing .....................................................................................................3-18
Design Considerations
4.1
Thermal Design Considerations........................................................................................................................4-1
4.2
Electrical Design Considerations......................................................................................................................4-2
4.3
Power Consumption Considerations.................................................................................................................4-3
4.4
PLL Performance Issues ...................................................................................................................................4-4
4.5
Input (EXTAL) Jitter Requirements .................................................................................................................4-5
Appendix A Power Consumption Benchmark
Data Sheet Conventions
OVERBAR
“asserted”
“deasserted”
Indicates a signal that is active when pulled low (For example, the RESET pin is active when
low.)
Means that a high true (active high) signal is high or that a low true (active low) signal is low
Means that a high true (active high) signal is low or that a low true (active low) signal is high
Examples:
Signal/Symbol
Logic State
Signal State
PIN
True
Asserted
PIN
False
Deasserted
PIN
True
Asserted
PIN
False
Deasserted
Note: Values for VIL, VOL, VIH, and VOH are defined by individual product specifications.
Voltage
VIL/VOL
VIH/VOH
VIH/VOH
VIL/VOL
DSP56303 Technical Data, Rev. 11
ii
Freescale Semiconductor
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