Typical Performance Curves (Continued)
EL2125
12
11.8
11.6
11.4
11.2
11
-50
VS = ±15V
0
50
100
150
DIE TEMPERATURE (°C)
FIGURE 47. LOADED POSITIVE OUTPUT SWING vs
TEMPERATURE
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.2
1
0.8 781mW
0.6
SO8
θJA=160°C/W
0.4 488mW
0.2
0
0
SOT23-5
θJA=256°C/W
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 48. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.8
1.6
1.4
1.2 1.136W
1
0.8
0.6 543mW
SO8
θJA=110°C/W
0.4
0.2
0
0
SOT23-5
θJA=230°C/W
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 49. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
12
FN7045.3
May 4, 2007