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EL5126(2003) View Datasheet(PDF) - Intersil

Part Name
Description
Manufacturer
EL5126 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
EL5126
The maximum power dissipation actually produced by the IC
is the total quiescent supply current times the total power
supply voltage and plus the power in the IC due to the loads.
PDMAX = VS × IS + Σ[(VS - VOUTi ) × ILOADi]
when sourcing, and:
PDMAX = VS × IS + Σ(VOUTi × ILOADi)
when sinking.
Where:
• i = 1 to total 8
• VS = Supply voltage
• IS = Quiescent current
• VOUTi = Output voltage of the i channel
• ILOADi = Load current of the i channel
By setting the two PDMAX equations equal to each other, we
can solve for the RLOAD's to avoid the device overheat. The
package power dissipation curves provide a convenient way
to see if the device will overheat.
POWER SUPPLY BYPASSING AND PRINTED CIRCUIT
BOARD LAYOUT
Good printed circuit board layout is necessary for optimum
performance. A low impedance and clean analog ground
plane should be used for the EL5126. The traces from the
two ground pins to the ground plane must be very short. The
thermal pad of the EL5126 should be connected to the
analog ground plane. Lead length should be as short as
possible and all power supply pins must be well bypassed. A
0.1µF ceramic capacitor must be place very close to the VS,
VREFH, VREFL, and CAP pins. A 4.7µF local bypass
tantalum capacitor should be placed to the VS, VREFH, and
VREFL pins.
APPLICATION USING THE EL5126
In the first application drawing, the schematic shows the
interconnect of a pair of EL5126 chips connected to give
8 gamma corrected voltages above the VCOM voltage, and
8 gamma corrected voltages below the VCOM voltage.
10

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