FAN2564(2009) View Datasheet(PDF) - Fairchild Semiconductor
Part Name
Description
Manufacturer
FAN2564 Datasheet PDF : 13 Pages
| |||
Physical Dimensions
E
BALL A1
INDEX AREA
E
0.03 C
2X
A
B
D
TOP VIEW
0.03 C
2X
A1
(Ø0.25)
Cu PAD
0.50
0.50
(Ø0.35)
SOLDER MASK
OPENING
RECOMMENDED LAND PATTERN (NSMD)
0.05 C
D
C
0.06 C
0.618
0.542
SEATING PLANE
SIDE VIEWS
0.330±0.013
0.250±0.025
(X)+/-.018
0.50
E
0.005 C A B
12 X Ø0.315 +/- .025
B
0.50
A
(Y)+/-.018
12
BOTTOM VIEW
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASMEY14.5M, 1994.
D. DATUM C, THE SEATING PLANE IS DEFINED
BY THE SPHERICAL CROWNS OF THE BALLS.
E. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
F. DRAWING FILENAME: UC004ABrev1
Figure 26. 4-Bump, Wafer-Level Chip-Scale Package (WLCSP), 0.5mm Pitch
Product Specific Dimensions
Product
D
FAN2564UCX
1.41 +/-0.030
E
0.93 +/-0.030
X
0.215
Y
0.455
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2007 Fairchild Semiconductor Corporation
FAN2564 • Rev. 1.0.1
11
www.fairchildsemi.com
Share Link: 