Electrical Characteristics
TA = 25°C unless otherwise noted
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) 130 °C/W when
mounted on a 0.125
in2 pad of 2 oz.
copper.
b) 140 °C/W when
mounted on a .004 in2
pad of 2 oz copper
c) 180 C°/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
FDFC3N108 Rev C (W)