FDS6670S View Datasheet(PDF) - Fairchild Semiconductor
Part Name
Description
Manufacturer
FDS6670S Datasheet PDF : 7 Pages
| |||
Electrical Characteristics
Symbol
Parameter
TA = 25°C unless otherwise noted
Test Conditions
Min Typ Max Units
Off Characteristics
BVDSS
Drain–Source Breakdown Voltage
∆BVDSS
∆TJ
IDSS
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
IGSSF
Gate–Body Leakage, Forward
IGSSR
Gate–Body Leakage, Reverse
VGS = 0 V, ID = 1 mA
ID = 1 mA, Referenced to 25°C
VDS = 24 V,
VGS = 20 V,
VGS = –20 V,
VGS = 0 V
VDS = 0 V
VDS = 0 V
On Characteristics (Note 2)
VGS(th)
Gate Threshold Voltage
∆VGS(th)
∆TJ
RDS(on)
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
ID(on)
On–State Drain Current
gFS
Forward Transconductance
VDS = VGS, ID = 1 mA
ID = 1 mA, Referenced to 25°C
VGS = 10 V,
VGS = 4.5 V,
ID = 13.5 A
ID = 11.2 A
VGS=10 V, ID =13.5A, TJ=100°C
VGS = 10 V,
VDS = 5 V
VDS = 10 V,
ID = 13.5 A
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS = 15 V,
f = 1.0 MHz
V GS = 0 V,
Switching Characteristics
td(on)
Turn–On Delay Time
tr
Turn–On Rise Time
td(off)
Turn–Off Delay Time
tf
Turn–Off Fall Time
Qg
Total Gate Charge
Qg s
Gate–Source Charge
Qgd
Gate–Drain Charge
(Note 2)
VDS = 15 V,
VGS = 10 V,
ID = 1 A,
RGEN = 6 Ω
VDS = 15 V,
VGS = 5 V
ID = 13.5 A,
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
VSD
Drain–Source Diode Forward
Voltage
VGS = 0 V, IS = 3.5 A
VGS = 0 V, IS = 7 A
(Note 2)
(Note 2)
trr
Diode Reverse Recovery Time
IF = 13.5A,
Qrr
Diode Reverse Recovery Charge
diF/dt = 300 A/µs
(Note 3)
30
V
24
mV/°C
500
µA
100
nA
–100 nA
1
2.2
3
V
–6.2
mV/°C
7
9
mΩ
9.5 12.5
9 12.5
50
A
45
S
2674
pF
751
pF
254
pF
11
20
ns
10
20
ns
44
70
ns
23
37
ns
24
34
nC
7.3
nC
6
nC
3.5
A
0.4 0.7
V
0.5
26.8
nS
47.2
nC
Notes:
1. RθJA is the sum of the junction-to-case and case -to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) 50°C/W when
mounted on a 1 in2
pad of 2 oz copper
b) 105°C/W when
mounted on a .04 in2
pad of 2 oz copper
c) 125°C/W when mounted on a
minimum pad.
FDS6670S Rev E (W)
Share Link: 