FIN1049(2013) View Datasheet(PDF) - Fairchild Semiconductor

Part Name

Description

Manufacturer

FIN1049
(Rev.:2013)

LVDS Dual-Line Driver with Dual-Line Receiver

Fairchild Semiconductor 

Physical Dimensions

5.00±0.10

4.55

4.4±0.1

0.11

0.65

1.45

5.00

5.90

4.45 7.35

12°

MTC16rev4

Figure 13. 16-Lead, Thin-Shrink Small-Outline Package (TSSOP), JEDEC MO-153, 4.4 mm Wide

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the

warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/.

© 2003 Fairchild Semiconductor Corporation

FIN1049 • Rev. 1.0.3

11

www.fairchildsemi.com

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