FOD816 View Datasheet(PDF) - Fairchild Semiconductor
Part Name
Description
Manufacturer
FOD816 Datasheet PDF : 9 Pages
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Package Dimensions (Through Hole) Package Dimensions (Surface Mount)
0.200 (5.10)
0.161 (4.10)
0.157 (4.00)
0.118 (3.00)
0.130 (3.30)
0.091 (2.30)
0.150 (3.80)
0.110 (2.80)
0.110 (2.79)
0.090 (2.29)
0.020 (0.51)
TYP
0.024 (0.60)
0.016 (0.40)
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
0.300 (7.62)
typ
0.010 (0.26)
0.200 (5.10)
0.161 (4.10)
0.157 (4.00)
0.118 (3.00)
0.051 (1.30)
0.043 (1.10)
0.024 (0.60)
0.004 (0.10)
0.110 (2.79)
0.090 (2.29)
Lead Coplanarity 0.004 (0.10) MAX
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
0.049 (1.25)
0.030 (0.76)
0.412 (10.46)
0.388 (9.86)
0.010 (0.26)
Package Dimensions
(0.4” Lead Spacing)
0.200 (5.10)
0.161 (4.10)
0.157 (4.00)
0.118 (3.00)
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
0.130 (3.30)
0.091 (2.30)
0.150 (3.80)
0.110 (2.80)
0.024 (0.60)
0.016 (0.40)
0.110 (2.79)
0.090 (2.29)
0.110 (2.80)
0.011 (1.80)
0.42 (10.66)
0.38 (9.66)
0.291 (7.40)
0.252 (6.40)
0.010 (0.26)
Footprint Dimensions
(Surface Mount)
1.5
1.3
9
2.54
NOTE
All dimensions are in inches (millimeters)
5
FOD816 Series Rev. 1.0.3
www.fairchildsemi.com
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