H5N2008P
Electrical Characteristics
Item
Symbol Min
Drain to Source breakdown voltage
V(BR)DSS
200
Zero Gate voltage Drain current
IDSS
—
Gate to Source leak current
IGSS
—
Gate to Source cutoff voltage
VGS(off)
3.0
Forward transfer admittance
|yfs|
35
Static Drain to Source on state
resistance
RDS(on)
—
Input capacitance
Ciss
—
Output capacitance
Coss
—
Reverse transfer capacitance
Crss
—
Turn-on delay time
td(on)
—
Rise time
tr
—
Turn-off delay time
td(off)
—
Fall time
tf
—
Total Gate charge
Qg
—
Gate to Source charge
Qgs
—
Gate to Drain charge
Qgd
—
Body-Drain diode forward voltage
VDF
—
Body-Drain diode reverse recovery time
trr
—
Body-Drain diode reverse recovery
Qrr
—
charge
Notes: 4. Pulse test
Typ
—
—
—
—
58
0.020
Max
—
1
±0.1
4.5
—
0.023
Unit
V
µA
µA
V
S
Ω
(Ta = 25°C)
Test conditions
ID = 10 mA, VGS = 0
VDS = 200 V, VGS = 0
VGS = ±30 V, VDS = 0
VDS = 10 V, ID = 1 mA
ID = 48 A, VDS = 10 V Note4
ID = 48 A, VGS = 10 VNote4
4900
—
pF VDS = 25 V
850
—
pF VGS = 0
95
—
pF f = 1 MHz
60
—
ns ID = 48 A
370
—
ns VGS = 10 V
220
—
ns RL = 2.1 Ω
270
—
ns Rg = 10 Ω
98
—
nC VDD = 160 V
25
—
nC VGS = 10 V
44
—
nC ID = 96 A
1.1
1.7
V IF = 96 A, VGS = 0 Note4
180
—
ns IF = 96 A, VGS = 0
1.5
—
µC diF/dt = 100 A/µs
Rev.3.00 Nov.24.2004 page 2 of 6