HCTS374K View Datasheet(PDF) - Intersil

Part Name

Description

Manufacturer

HCTS374K

Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered

Intersil 

Die Characteristics

DIE DIMENSIONS:

108 x 106 mils

METALLIZATION:

Type: AlSi

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

D0

Q0

(3)

(2)

HCTS374MS

HCTS374MS

OE

VCC

Q7

(1)

(20)

(19)

D1 (4)

Q1 (5)

Q2 (6)

(18) D7

(17) D6

(16) Q6

(15) Q5

D2 (7)

(14) D5

(8)

(9)

D3

Q3

(10)

(11)

GND

CP

(12)

(13)

Q4

D4

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS374 is TA14404A.

Spec Number 518635

659

Share Link: