HDMP-1032 View Datasheet(PDF) - HP => Agilent Technologies
Part Name
Description
Manufacturer
HDMP-1032 Datasheet PDF : 32 Pages
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HDMP-1032 (Tx) Thermal Characteristics
TA = 25°C
Symbol
Parameter
θjc1
Thermal Resistance, Die to Case
PD
Power Dissipation, VCC = 3.3 V
Unit Typ.
°C/W 8
mW 590
HDMP-1034 (Rx) Thermal Characteristics
TA = 25°C
Symbol
Parameter
θjc1
Thermal Resistance, Die to Case
PD
Power Dissipation, VCC = 3.3 V
Unit
Typ.
°C/W
8
mW
660
I/O Type Definitions
I/O Type
Definition
I-TTL
Input TTL. Floats high when left open.
O-TTL
Output TTL
HS_OUT
50 Ω Matched Output Driver. Will drive AC coupled 50 Ω loads. All unused outputs
should be AC coupled to a 50 Ω resistor to ground.
HS IN
High Speed Input
C
Filter Capacitor Node
S
Power Supply or Ground
Note:
1. Based on independent package testing by HP. θjc for the HDMP-1032 and HDMP-1034 is 50°C/W. θjc is measured on a standard
3" x 3" two layer PCB in a still air environment. In order to determine the actual junction temperature in a given application, use the following
formula: TJ = TC + (θjc x PD), where TC is the case temperature measured on the top center of the package and PD is the power being dissipated.
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