HDMP-0450 View Datasheet(PDF) - HP => Agilent Technologies
Part Name
Description
Manufacturer
HDMP-0450 Datasheet PDF : 10 Pages
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Package Information
Power Dissipation and Thermal Resistance
VCC = 3.15 V to 3.45 V
Symbol
Parameter
Units Typ. Max.
PD
Power Dissipation
θjc[1]
Thermal Resistance, Junction to Case
mW
500
640
°C/W 7
Note:
1. Based on independent package testing by Agilent. θja for this device is 57°C/W. θja is measured on a standard 3x3” FR4 PCB in a still air environment. To
determine the actual junction temperature in a given application, use the following equation:
Tj = Tc + (θjc x PD), where Tc is the case temperature measured on the top center of the package and PD is the power being dissipated.
Item
Package Material
Lead Finish Material
Lead Finish Thickness
Lead Skew
Lead Coplanarity (Seating Plane)
Details
Plastic
85% Tin, 15% Lead
200-800 micro-inches
0.33 mm max.
0.10 mm max.
Mechanical Dimensions
PIN #1 ID
44 43 42 41 40 39 38 37 36 35 34
1
33
2
32
3
31
4
30
5
29
6
TOP VIEW 28
7
27
8
26
9
25
10
24
11
23
12 13 14 15 16 17 18 19 20 21 22
E1 E
D1
D
A2
A1
A
SEATING
PLANE
b
e
c
0.25
L
GUAGE
PLANE
ALL DIMENSIONS ARE IN MILLIMETERS
PART NUMBER E1/D1 E/D
b
e
L
c
A2 A1
A
HDMP-0450 10.00 13.20 0.35 0.80 0.88 0.23 2.00 0.25 2.45
TOLERANCE ± 0.10 ± 0.20 ± 0.05 BASIC + 0.15/ MAX. + 0.10/ ± 0.25 MAX.
– 0.10
– 0.05
Figure 7. HDMP-0450 package drawing.
8
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