HIN206 View Datasheet(PDF) - Harris Semiconductor
Part Name
Description
Manufacturer
HIN206
Harris Semiconductor
HIN206 Datasheet PDF : 14 Pages
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HIN200 thru HIN213
Absolute Maximum Ratings
VCC to Ground . . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) <VCC < 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . (VCC -0.3V) <V+ < 12V
V- to Ground . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V)
Input Voltages
TIN . . . . . . . . . . . . . . . . . . . . . . . . . (V- -0.3V) < VIN < (V+ +0.3V)
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . . (V- -0.3V) < VTXOUT < (V+ +0.3V)
ROUT. . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V)
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ROUT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Operating Conditions
Temperature Range
HIN-XXXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0oC to 70oC
HIN-XXXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
Thermal Information
Thermal Resistance (Typical, Note 1)
θJA (oC/W)
16 Ld SOIC (N) Package . . . . . . . . . . . . . . . . . . . . .
115
16 Ld SOIC (W) Package . . . . . . . . . . . . . . . . . . . .
100
16 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
155
16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . .
90
20 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
100
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
75
24 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
135
24 Ld PDIP (N) Package . . . . . . . . . . . . . . . . . . . . .
75
24 Ld PDIP (W) Package. . . . . . . . . . . . . . . . . . . . .
60
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
70
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
100
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . . .-40oC to 85oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC and SSOP - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications Test Conditions: VCC = +5V ±10%, (VCC = +5V ±5% HIN200, HIN203, HIN205, HIN207); V+ = 9V to
13.2V, HIN201 and HIN209), C1-C4 = 0.1µF; TA = Operating Temperature Range
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Output Voltage Swing, TOUT
Power Supply Current, ICC
Transmitter Outputs, 3kΩ to Ground
±5
No Load,
HIN202, HIN203
-
TA = 25oC
HIN200, HIN204-208,
-
HIN211-213
±9
±10
V
8
15
mA
11
20
mA
HIN201, HIN209
-
0.4
1
mA
V+ Power Supply Current, ICC
Shutdown Supply Current, ICC(SD)
No Load,
TA = 25oC
TA = 25oC
HIN201
HIN209
HIN200, HIN205,
HIN206, HIN211
-
5.0
10
mA
-
7.0
15
mA
-
1
10
µA
HIN213
-
15
50
µA
Input Logic Low, TIN, EN, VlL
Input Logic High, VlH
TIN, EN, SD, EN, SD
TIN
EN, SD, EN, SD
-
-
0.8
V
2.0
-
-
V
2.4
-
-
V
Logic Pullup Current, IP
RS-232 Input Voltage Range, VIN
Receiver Input Impedance, RIN
Receiver Input Low Threshold, VIN (H-L)
TIN = 0V
TA = 25oC, VIN = ±3V
VCC
TA =
= 5V,
25oC
Active Mode
Shutdown Mode
HIN213 R4 and R5
-
15
200
µA
-30
-
+30
V
3.0
5.0
7.0
kΩ
0.8
1.2
-
V
0.6
1.5
-
V
8-11
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